![]() ![]() Details ID#: 9146586 Category: Die Attachers Vintage: 2006. Document/File: datacon-2200-evo-manual.pdf, filesize: n/a.ĭATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. The new world of advanced packaging 2200 evo Twin-Head Multi-Chip Die Bonder Maintenance Release 3.0 Documentation member of Besi group Version history Release 1.0 2.The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Datacon's 2200 evo will suit your laboratory development and high-volume production needs perfectly and will grow with your requirements.Datacon EVO 2200 Bond Head Auto Calibration. Consult BE Semiconductor Industries's 2200 evo brochure on DirectIndustry.Datacon 2200 evo plus Die placement temperature 120.Manual flip-chip bonding high accuracy 0.5. Datacon 2200 Bonder (flip chip process).By clicking Sign In, I will check the data entered to pass our security cretentials.It can be operated by seating personnel for best performance of the manual. ![]()
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